A major issue in the production of electronic connectors is part warpage.
This can be caused by unbalanced mold filling due to poor wall thickness design, which further leads to non-uniform shrinkage. These problems can be identified and virtually prototyped with Moldex3D simulations, establishing proper part thickness to balance the filling pattern and hence reduce the part warpage by 20%.
Moldex3D improves company competitiveness in the electronics industry. Moldex3D is a suite of advanced injection molding simulation solutions for plastic part verification and mold optimization. It has been widely applied to solve common manufacturing difficulties, such as short shot, air trap, welding line, burn marks, etc. Furthermore, through the improvement in product quality and cycle time, users can create higher value at lower costs in the product development process.
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